Engineering Articles
This section collects deep-dive technical articles focused on practical power electronics, MOSFET driving,
high-current buck converters, PCB layout, measurement techniques, and reliability.
Each article is written for working engineers and advanced hobbyists, with real component examples, layout
notes, and debugging checklists.
Latest articles
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Why a dedicated gate driver is mandatory for modern power MOSFETs, how gate charge (Qg and Qgd) really
works, which driver ICs (UCC27531, IRS2007, FAN7392) fit typical devices like IRLZ44N or IPP110N20N3,
and how to avoid ringing, shoot-through, and EMI in real SMPS and half-bridge designs.
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Practical layout rules for high-current buck converters: current loops, placement of input/output
capacitors,
switch node routing, ground planes, thermal paths and EMI reduction for 10–50 A designs.
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A practical SMPS design guide: topology selection, AC/DC converter schematic basics, power MOSFET
selection,
gate driver reference, compensation, PCB design rules and EMI/EMC PCB considerations for reliable
power electronics circuits.
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How to choose power MOSFETs for SMPS designs and motor driver circuits: voltage and current rating,
RDS(on),
gate charge Qg, SOA, body diode behavior, package and thermal design, plus practical examples for buck
converters and BLDC motor drivers.
Compact SMD resistor codes chart and SMD capacitor codes reference: E24/E96 markings, 3- and 4-digit
codes,
EIA-96 scheme, common package sizes, and practical tips for decoding resistor color code and capacitor
value
markings directly on the PCB.
Practical cheat sheet for SMD transistor codes and diode marking codes: SOT-23, SOT-323 and SOD packages,
Schottky and fast switching diodes, Zener identifiers and tips for decoding unknown SMD parts on real
PCBs.
Practical PCB stackup reference for high-speed digital and power electronics: FR-4 material properties,
4-layer and 6-layer stackup templates, impedance-controlled routing and multilayer PCB guidelines for
SMPS, motor drives and mixed-signal designs.
A step-by-step EMI/EMC layout checklist for buck, boost and flyback DC/DC converters:
current loops, switch node routing, grounding, filtering, snubbers and probing tips for passing CISPR/EN
tests.
How to size and select DC-link capacitors for SMPS, inverters and motor drives:
ripple current rating, ESR, lifetime, film vs electrolytic, and practical layout tips.
Overview of SMPS current sensing methods: shunt, RC-filtered sense, current transformers, drain-source
sensing,
Hall sensors and integrated current sense amplifiers — accuracy, losses and layout rules.
Practical PCB layout rules for SiC and GaN gate drivers: loop inductance, Kelvin source, gate resistors,
dV/dt control, isolation, and avoiding false triggering at 50–200 V/ns.
How to choose the right power MOSFET: voltage rating, RDS(on), gate charge, SOA, package, thermal limits
and
practical tips for SMPS and motor drivers.
Practical guide to flyback transformer design: core selection, winding, insulation, thermal management and
troubleshooting.
Detailed comparison of N-channel and P-channel MOSFETs for modern power electronics: RDS(on), efficiency,
switching
speed, thermal performance, EMI behavior and body diode recovery, with practical design guidelines for
high-side
switches, DC-DC converters, motor drivers and battery-powered systems.
